PF305-92MVO

Product Information

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Solder paste

●Forms bumps via the solder paste printing method, without using any special equipment
   Applicable with conventional SMT surface mount facilities
●Available for forming bumps or precoating

PF305-92MVO

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■Bar・Wire solder
■Preform solder
■Flux-cored wire solder
HF1•HF4
■Solder paste
133
140
150(A)
152
153
155(NEW)
156(NEW)
150(A1)(NEW)
150(A8)(NEW)
117(TF)
V302
92M
LT7
207 Series
207S(HF-T)(NEW)
■Metal adhesive
MAX102, 1022, 112
■Conductive adhesive
ECA100, 151, 170
ECA202
■Thermal conductive grease
TG221, 240, 260

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