PF1072-152TO

Product Information

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Solder paste

●The 2nd-generation reflow solder paste, Sn-1.0Ag-0.7Cu-2Bi recommended by JEITA
●Stably consecutive  printability
●Superior inhibitory effect  for void generation despite low silver content

PF1072-152TO

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■Bar・Wire solder
■Preform solder
■Flux-cored wire solder
HF1•HF4
■Solder paste
133
140
150(A)
152
153
155(NEW)
156(NEW)
150(A1)(NEW)
150(A8)(NEW)
117(TF)
V302
92M
LT7
207 Series
207S(HF-T)(NEW)
■Metal adhesive
MAX102, 1022, 112
■Conductive adhesive
ECA100, 151, 170
ECA202
■Thermal conductive grease
TG221, 240, 260

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