PF305-153TO

Product Information

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Pb-free Solder Paste for SMT
  Released a new solder paste
  overcome head in pillow defect in BGA package

PF305-153TO   Alloy Composition : Sn-3.0Ag-0.5Cu
Flux : Halogen Free, ROL0 in IPC standards
Available fine BGA mounting thanks to fine printability and Solubility 

The mechanism how head in pillow defect occurs in BGA package

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Schematic diagram of head in pillow defect caused by warpage in the package

Secured fine printability and fine solubility required for BGA package
Fine solubility even at air reflow

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【Test board】
【Reflow condition】
・Substrate : FR-4
・Air reflowing 
・Mask : 0.2mmΦ and 0.12mmT
・Preheating 100sec at 180 to 190℃
    ・Peak temp. 240℃, 26sec for 220℃

Improved wettability with maintaining strong activity despite halogen free

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