PF305-153TO

Product Information

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Pb-free Solder Paste for SMT
  Released a new solder paste
  overcome head in pillow defect in BGA package

PF305-153TO   Alloy Composition : Sn-3.0Ag-0.5Cu
Flux : Halogen Free, ROL0 in IPC standards
Available fine BGA mounting thanks to fine printability and Solubility 

Secured fine printability and fine solubility required for BGA package
Fine solubility even at air reflow

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【Test board】
【Reflow condition】
・Substrate : FR-4
・Air reflowing 
・Mask : 0.2mmΦ and 0.12mmT
・Preheating 100sec at 180 to 190℃
    ・Peak temp. 240℃, 26sec for 220℃

The mechanism how head in pillow defect occurs in BGA package

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Schematic diagram of head in pillow defect caused by warpage in the package

Improved wettability with maintaining strong activity despite halogen free

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