NIHON HANDA CO.,LTD.
 LEAD-FREE SOLDER ALLOY (1)
Nihon Handa's
LEAD-FREE SOLDER ALLOY
 The demand for Lead-Free Solder is rapidly increasing in recent years,since the risk of soil(water) contamination by lead containing solder became one of the center issues of environmental concerns and the prompt implementation of lead-free soldering is recognized as the must move for political and economical considerations by many electronics manufacturers. To cope with this trend in the industry,many different lead-free solder alloy compositions have been and still are researched and developed,though,unfortunately,it is now widely acknowledged fact that there is no drop-in replacement for Tin-Lead solder in overall performance in electronic application. However,Sn-Ag-Cu system has emerged as the most promising candidate for lead-free solder.
 Nihon Handa has developed its own lead-free alloy compositions,established licensing agreements and continued research and evaluation of various alloy compositions to meet requirements of customers' applications. Listed below are some of the lead-free solder available from Nihon Handa Co. Other alloy compositions may be available upon request.

Code Alloy Composition Melting Temperature
 PF27  Sn/Ag/Cu/Ge 217-219℃
 PF33  Sn/Ag/Bi/Cu/Ge 206-213℃
 PF305  Sn/Ag/Cu 218-219℃
 Castin Alloy*  Sn/2.5Ag/0.8Cu/0.5Sb 216-220℃
 Oatey Alloy**  Sn/Ag/Cu/Bi ***

 Sn/58Bi 139℃

 Sn/3.5Ag 221℃

 Sn/0.7Cu 227℃

 Sn/5Sb 235-240℃
*
**
***
Castin is a registered trademark of AIM Ink.
Oatey is a registered trademark of Oatey Company.
Because of the wide composition range of Oatey alloy, melting temperature varies.
PF27,PF33,Castin,Sn/Ag3.5 alloys are available in bar,cored wire,sphere and solder paste.
PF305 alloy is available in bar,cored wire and solder paste.
For other alloys,inquire Nihon Handa.
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