Nihon Handa Co., Ltd.

News & information
Head hoffice in Tokyo is moved
○Added new products
 Overcome head in pillow defect in BGA package:PF305-153TO
○Added new products
 Less Voids even at Air Reflow:PF305-150TO(A)
○Added new products
 Second-generation alloy solder paste recommended by JEITA:PF1072-152TO,Melting temperature solder paste:PF142-LT7TO
○Information on the execution of a memorandum regarding the contract of business partnership and patent cross-license with Heraeus, Germany