Solder paste for power device die bonding
・ Reduced flux residue despite maintaining good wettability
・ Environment-friendly non-halogen type
・ Good void suppression effect comparable to halogen-added products
Optimized flux design attainable both low residue and wettability
Good void properties despite non-halogen
Despite non-halogen, maintains same or better void suppression effect as compared to halogen-added products.