Highly reliable solder alloy
SnSb alloy solder paste for power module application
PF830-150TO(A1)
・ Features high reliable alloy suitable for power module application
・ Adopts optimum flux available bonding under chip and under DBC
・ Realize low void bonding even under Ni-plated DBC
Highly reliable Sn-Sb Solute Strengthening & Sn-Ag precipitation Strengthening
Optimum flux performance suitable for bonding power module
150A1
