Lead free solder paste for SMT
Halogen-free High-performance Solder Paste
PF305-155TO
・ High-performance general-purpose product for versatile application
・ High void suppression effect at back electrodes
・ Prevent chip-side balls
High-performance general-purpose product for versatile application
High void suppression effect at back electrodes
【Test Condition】
Reflow：Air； Thickness of stencil：0.1mm; Preheat Temp.：150 to 190deg. C, 100sec.；Peak Temp.：240deg. C, 40sec. or more for 220deg. C
155TO
