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Bar・Wire solder

Preform solder
●Usage：die bond for power devices, semiconductor IC, sealing package ●Shape：pellet (disc, square), tape, wire ●Characteristics ・Uses high-purity alloy which minimizes impurities ・Eliminates dissolved gas (only for lead containing types), which is one of the causes for voids, by the vacuum refining method(degassing treatment) ・Ensures excellent wettability without any taint, oil content, oxidized material, or scratches on the surface ・Smooth and no sticking of solders ・Embossed tape package available for the pellet types ・Proven track record for in-vehicle equipment, industrial equipment, and other fields requiring high reliability

Flux-cored wire solder
●We added two new types to the RZ-21 RMA series : halogen-free and non-harogen ●Both RZ-21 RMA (HF1) and RZ-21 RMA (HF4) have soldering properties equivalent to those of halogen type and they significantly reduce flux residue cracks and scattering compared to conventional products.
RZ-21RMA (HF1)
RZ-21RMA (HF4)

Solder paste

PF305-133TO ●Ensures wettability by using non-halogen activator ●Soldering properties equivalent to those of conventional halogen types
PF305-140TO ●Excellent void reduction effect with halogen free benefits ●Maintains an excellent heating prevention effect
PF305-150TO(A) ●Reducing void generation in large area printing even at air atmosphere ●Good wettability even on oxidized substrates at air atmosphere ●Less solder bridges and less solder balls due to good wettability
PF305-153TO ●Available fine BGA mounting thanks to fine printability and Solubility
PF1072-152TO ●The 2nd-generation reflow solder paste, Sn-1.0Ag-0.7Cu-2Bi recommended by JEITA ●Stably consecutive printability ●Superior inhibitory effect for void generation despite low silver content
PF305-117TO(TF) ●Good wettability despite halogen-free flux ●Maintains an excellent heat slumping prevention effect
PF305-V302TO ●Excellent void reduction effect regardless of reflow condition ●Improved wettability for nickel platings and fewer voids ●Applicable to bond large areas such as those of power semiconductors ●Cleanable with various types of cleaning liquids
PF305-92MVO ●Forms bumps via the solder paste printing method, without using any special equipment ●Applicable with conventional SMT surface mount facilities ●Available for forming bumps or precoating
PF142-LT7TO ●Good wettability with halogen free benefits ●Excellent soldering property with low-temperature reflow
207S series for dispensers ●Stable discharging performance ●Offering various types of syringe containers

Metal adhesive
Sintering metal paste MAX series ●The sintering metal paste MAX series is a lineup of new paste products with high thermal conductivity, high conductivity, and high thermal stability. They can be used for pressureless sintering by utilizing the high surface energy of metal particles.

Conductive adhesive
Epoxy silver paste: ECA100,151,170 ●ECA100 series is silver epoxy conductive adhesive of one-component. ●Our product line up includes [ECA-100] with the"excellent workability of a one-component adhesive" and "both low-temperature curing and room-temperature storage" and [ECA-151] with the benefits of a "one- component adhesive with a focus on workability", "a super long pot life", and, "room- temprature storage for 3 months". Epoxy nickel paste： ECA202 ●ECA202 is nickel epoxy conductive adhesive of one-component. ●Compatible both low temperature curing and storage stability at the normal temperature. ●Actualizes low cost due to the use of nickel. ●Stable conductivity even with tin electrode.

Thermal conductive grease
TG200 series: TG221, TG240, TG260 ●TG200 series is non-silicon thermal conductive grease. ●Excellent thermal resistance without volatiles such as those of siloxane