SAC305 Solder Paste for Power Module Application
PF305-156HO
・ Effective low void for both under chip and DBC regardless of soldering area
・ Prevent dislocation of parts on pad during reflow
・ Applicable with versatile cleaning agent against flux residues
Optimized characteristics for soldering power modules
Prevent dislocation of chip
Reduce heat slump & fluidity at preheating and prevent dislocation of part on pad during reflow
156HO
